One always needs to aim for the impossible to reach the possible.
Thick copper technology
Thick copper technology
Thick copper technologies up to 210 µm for power electronics.
HDI/Microvia-Technology
HDI/Microvia-TechnologY
The higher packaging density of components, like for example with BGAs require new layout structures. Through laser-via-technology or controlled mechanical deep drilling, the connections with the inner layers can be established by means of either staggered or stacked technology.
Impedance-controlled PCBs
Impedance-controlled PCBs
The impedance of a conductor path depends on the following factors:
- the selected configuration (strip line, micro strip, etc.)
- the physical dimensions (width and height of the conductor path)
- the dielectric spacing (multilayer construction)
- the dielectric constant (Er) of the base material
Half copper-plated drills
Half copper-plated drills
Half copper-plated drills, e.g. in order to solder the PCB directly onto a metal frame
EMC-shielding
EMC-shielding
EMC-shielding through the copper coating of the outer edge of the PCB, alternatively also through deep milling, that works as a screen for recessed components after being copper- or gold-plated.
