Multilayer printed circuits consisting of pure Teflon and mixed materials (FR4 and Teflon).
High frequency materials
Portfolio
Portfolio
- Fusion bonding with high-temperature pressing up to 350°C
- Heat sink technology
- Mixed materials (FR4 + Teflon)
- Thickness from 0.2 mm
- Soft boards
Materials
Materials
- Taconic (e.g. TLC, TLP, RF30, Taclam+, etc.)
- Rogers (e.g. RO4350, RO3003, LCP)
- Neltec (e.g. NX9250, NY9217, NY9320, etc.)
- Arlon (e.g. CLTE, DiClad, etc.)
- Isola (e.g. IS650, etc.)